Thermal-induced slippage of soft solid films
نویسندگان
چکیده
منابع مشابه
Slippage toughness measurement of soft interface between stiff thin films and elastomeric substrate.
Traditional interfacial toughness measurements for thin films on substrate are not appropriate to the structure composed of stiff films and soft substrate. This paper describes a new bending test system to measure the interfacial toughness for the soft interface between stiff films and elastomeric substrate. The experimental setup including the loading stages is easy to operate and scanning ele...
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ژورنال
عنوان ژورنال: Physical Review E
سال: 2019
ISSN: 2470-0045,2470-0053
DOI: 10.1103/physreve.99.010501